Pratik Malhotra
Associate
Pratik invests at the intersection of Digital and Industrial technologies, backing transformative, second-order opportunities with category-defining potential.
Pratik started his career with PwC in their Restructuring & Turnaround Consulting practice, advising corporates, investors, and lenders on special situations, distressed assets, and operational transformations. He later gained experience across the investment cycle in commercial due diligence, infrastructure PE, VC, and startup fundraising, before joining the investment team at Hitachi Ventures.
He holds a Double Master’s degree: an MSc in Finance from WHU – Otto Beisheim School of Management and an MSc in Management from EMLyon business school
Areas of Interest
- AI
- Digital Infrastructure
- FinTech
- Industrial Automation (HW & SW)
- InsurTech
- Robotics
- SaaS
- Semiconductors
- Supply Chain
Active Investments
SLM and Agentic Workflow Automation Platform
Arcee AI is focused on creating highly efficient, secure, and domain-specific AI solutions that drive automation, streamline workflows, and deliver measurable value across various sectors, including finance, healthcare, and legal.
CEO
Mark McQuade
Sectors
Digital
Stage
Series A
HQ
California
Deal Team
Gayathri (G) Radhakrishnan
Pratik Malhotra
Invisix provides non-destructive inline 3D metrology for buried nanoscale structures in advanced semiconductor manufacturing.
Invisix develops soft X-ray 3D-metrology tools for advanced semiconductor manufacturing. Spun out of ASML, its technology lets fabs measure buried nanoscale structures in GAA, CFET, and next-generation architectures. This brings inline, non-destructive process control to regimes where conventional optical and electron-beam tools hit their resolution limits.
CEO
Christina Porter
Sectors
Digital
Stage
Seed
HQ
Eindhoven, Netherlands
Deal Team
Vamsi Patti
Wolfgang Seibold
Pratik Malhotra
Development of thermal interface materials based on nanostructured copper to enhance heat transfer from high-performance chips.
NovoLINC develops next-generation thermal interface materials based on nanostructured copper to dramatically enhance heat transfer from high-performance chips. As AI workloads push chip power densities higher, making thermal management a key bottleneck in data-center design – NovoLINC’s technology delivers significantly lower thermal resistance and let’s chips run cooler and more reliably.
CEO
Ning Li
Sectors
Digital
Stage
Stage +
HQ
Pittsburgh
Deal Team
Wolfgang Seibold
Vamsi Patti
Pratik Malhotra
The AI operating system for manufacturing and supply chain operations.
Exited
Regrello is building an AI-powered supply chain manager that combines traditional and generative AI to automate end-to-end operational and back-office workflows. Regrello auto generates process diagrams and eliminates manual work, accelerates cycle times, and transforms fragmented processes into intelligent, adaptable systems built for speed, scale, and efficiency.
CEO
Aman Naimat
Sectors
Digital
Industrial
Stage
Series A
HQ
California
Deal Team
Wolfgang Seibold
Jan Marchewski
Pratik Malhotra
The World’s First Self-Aligning, Detachable and HVM Ready Fiber-to-Chip Connector
Exited
Teramount is a developer of advanced optical connectivity solutions for the semiconductor industry, focusing on the integration of fiber optics with silicon photonics. Their patented Universal Photonic Coupler and Photonic-Plug technologies, enable scalable and cost-effective assembly of optical fibers to silicon photonic chips using standard semiconductor manufacturing processes. These solutions are designed to meet the growing demand for high-speed, high-bandwidth applications such as AI, data centers, and telecommunications by simplifying fiber-to-chip connectivity and supporting high-volume, wafer-level packaging and testing.
CEO
Hesham Taha
Sectors
Digital
Stage
Series A
Deal Team
Gayathri (G) Radhakrishnan
Vamsi Patti
Pratik Malhotra
