Prior to joining Hitachi Ventures, Pratik worked at PricewaterhouseCoopers (PwC) in the Restructuring & Turnaround Consulting practice, advising corporates, investors, and lenders on complex special situations, distressed assets, and operational transformations. He later broadened his perspective across the investment cycle through roles in infrastructure private equity, corporate venture capital, and startup fundraising.
Pratik holds a Double Master’s degree: an MSc in Finance from WHU – Otto Beisheim School of Management and an MSc in Management from emlyon business school.
Areas of Interest
- AI
- Digital Infrastructure
- FinTech
- Industrial Automation (HW & SW)
- InsurTech
- Robotics
- SaaS
- Semiconductors
- Supply Chain
Active Investments
SLM and Agentic Workflow Automation Platform
Arcee AI is focused on creating highly efficient, secure, and domain-specific AI solutions that drive automation, streamline workflows, and deliver measurable value across various sectors, including finance, healthcare, and legal.
CEO
Mark McQuade
Sectors
Digital
Stage
Series A
HQ
California
Deal Team
Gayathri (G) Radhakrishnan
Aditi Purandare
Pratik Malhotra
The AI operating system for manufacturing and supply chain operations.
Exited
Regrello is building an AI-powered supply chain manager that combines traditional and generative AI to automate end-to-end operational and back-office workflows. Regrello auto generates process diagrams and eliminates manual work, accelerates cycle times, and transforms fragmented processes into intelligent, adaptable systems built for speed, scale, and efficiency.
CEO
Aman Naimat
Sectors
Digital
Industrial
Stage
Series A
HQ
California
Deal Team
Wolfgang Seibold
Jan Marchewski
Pratik Malhotra
The World’s First Self-Aligning, Detachable and HVM Ready Fiber-to-Chip Connector
Teramount is a developer of advanced optical connectivity solutions for the semiconductor industry, focusing on the integration of fiber optics with silicon photonics. Their patented Universal Photonic Coupler and Photonic-Plug technologies, enable scalable and cost-effective assembly of optical fibers to silicon photonic chips using standard semiconductor manufacturing processes. These solutions are designed to meet the growing demand for high-speed, high-bandwidth applications such as AI, data centers, and telecommunications by simplifying fiber-to-chip connectivity and supporting high-volume, wafer-level packaging and testing.
CEO
Hesham Taha
Sectors
Digital
Stage
Series A
Deal Team
Gayathri (G) Radhakrishnan
Vamsi Patti
Pratik Malhotra